概述

The ExaMAX^® connector system is designed to enable superior 25 Gb/s electrical performance and provide a path to 40 Gb/s in anticipation of further increases in bandwidth requirements and the data rates used for high speed signaling.

ExaMAX^® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance compared to typical blade-on-beam contact structures and provides exceptionally low mating force while maintaining excellent contact normal force.

Protected mating interfaces for both backplane and daughter card connectors also eliminate the exposed header pin field on the backplane, which can be susceptible to damage.

Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 40 Gb/s. The simple, functional design contributes to a very cost-effective solution.

The ExaMAX^® high speed backplane connector family includes a direct mate orthogonal (DMO) connector with up to 72 differential pairs per node. This connector provides superior electrical performance, and reduces cost by eliminating the midplane, facilitating front-to-rear cooling and reduced chassis height compared to traditional backplane and midplane systems.

目标市场及应用

Communications

• Switches
• Routers
• Optical Transport
• Wireless Infrastructure